Absolutely...Stimpy wrote: ↑Mon Nov 12, 2018 8:46 pm ICs best routed direct to power and ground plane with as short as possible tracks, ideally via right next to pad. Then place caps in small package as possible, again with vias to decouple the plane. Place vias to side of caps for smallest inductance loop, imagine viewing the board if it was sliced along the layers. Choose highest value within your budget with a decent dielectric and spec the voltage 2x or 3x the DC bias. Then more larger ceramics for bulk. This is perhaps overkill but if you ever need to do high speed designs and pass EM testing, that will get it through. Also a tip on switch mode power supplies, get your inductors round the right way!
Pretty much exactly what i have here.
I'm probably 1 cap short if you go by the rules of thumb.